Title:
POLISHING BODY AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/012468
Kind Code:
A1
Abstract:
Provided is a polishing body (LHA pad) which is used for polishing by a CMP method and which is capable of achieving stable polishing performance and uniformly polishing a workpiece. Also provided is a manufacturing for the polishing body. The polishing body (10) comprises a matrix resin (12) and multiple polishing particles (14) and is formed into a disc-like shape having a plurality of vertically-long pores (18). The matrix resin (12) is provided with communication holes (16) which are in communication with the vertically-long pores (18) and with each other. The interior of each of the communication holes (16) is provided with at least one or more polishing particles (14). The mean diameter of the communication holes (16) is no more than 18 times that of the polishing particles (14). Since the polishing body (10) stably encapsulates polishing particles (14) in communication holes (16) during polishing and has vertically-long pores (18), the polishing body (10) is able to achieve stable polishing performance and can uniformly polish a workpiece.
Inventors:
OMORI WATARU (JP)
YAMAGUCHI TAKAYA (JP)
KITAJIMA SHOTA (JP)
SATO MAKOTO (JP)
YAMAGUCHI TAKAYA (JP)
KITAJIMA SHOTA (JP)
SATO MAKOTO (JP)
Application Number:
PCT/JP2017/025178
Publication Date:
January 18, 2018
Filing Date:
July 10, 2017
Export Citation:
Assignee:
NORITAKE CO LTD (JP)
International Classes:
B24B37/24; B24D3/00; B24D3/32; B24D11/00; H01L21/304
Domestic Patent References:
| WO2014045653A1 | 2014-03-27 |
Foreign References:
| JP2011049256A | 2011-03-10 | |||
| JP2011067923A | 2011-04-07 | |||
| JP2008068390A | 2008-03-27 | |||
| JP2016117152A | 2016-06-30 | |||
| JP2002144220A | 2002-05-21 | |||
| JP2011212809A | 2011-10-27 | |||
| JP2010228009A | 2010-10-14 | |||
| JP2002075934A | 2002-03-15 |
Attorney, Agent or Firm:
IKEDA Haruyuki et al. (JP)
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