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Patent Searching and Data


Title:
POLISHING BRUSH AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/208566
Kind Code:
A1
Abstract:
A polishing brush (1) comprises a plurality of linear abrasive materials (32) formed by hardening an aggregate yarn of inorganic filaments by a resin binder, and a holder (2) for holding the plurality of linear abrasive materials (32). The linear abrasive materials (32) are held by a base (31), and the base (31) is secured to a spindle (25) inside the holder (2). Inside the spindle (25), a flow path (28) through which a liquid cutting agent is discharged toward the side on which the free ends (33) of the linear abrasive materials (32) are located is formed.

Inventors:
AKASHI Mitsuhisa (3685-2, Minamiminowa-mura, Kamiina-gu, Nagano 97, 〒3994597, JP)
SUMIYOSHI Norihiko (7-25, Koujimachi 1-chome, Chiyoda-k, Tokyo 83, 〒1020083, JP)
Application Number:
JP2014/066730
Publication Date:
December 31, 2014
Filing Date:
June 24, 2014
Export Citation:
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Assignee:
TAIMEI CHEMICALS CO., LTD. (3685-2, Minamiminowa-mura Kamiina-gu, Nagano 97, 〒3994597, JP)
XEBEC TECHNOLOGY CO., LTD. (7-25, Koujimachi 1-chome Chiyoda-k, Tokyo 83, 〒1020083, JP)
International Classes:
B24D13/14; A46B13/02; B24B29/00
Foreign References:
JPS6352962A1988-03-07
JP2003136413A2003-05-14
EP1797993A12007-06-20
JPS4941864U1974-04-12
JPH03234460A1991-10-18
Attorney, Agent or Firm:
YOKOZAWA Shiro et al. (1132-18, Shimadachi Matsumoto-sh, Nagano 52, 〒3900852, JP)
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