POLISHING BRUSH

WIPO Patent Application WO/2016/067347

A1

A polishing brush (1) is provided with: a brush-shaped grindstone (12) in which a plurality of abrasive material bundles (11) comprising a bundled linear abrasive material (27) are held in an annular shape; and an abrasive material displacement-regulating member (13) that regulates the displacement of the abrasive bundles (11) toward the outer peripheral side. The brush-shaped grindstone (12) is provided with an abrasive material holder (15) that holds the base end part (the upper end part) of each of the abrasive bundles (11). The abrasive material displacement-regulating member (13) is provided with an annular section (33) that surrounds the linear abrasive material (27) from the outer peripheral side at a position between the tip of the linear abrasive material (27) and the abrasive material holder (15) in the central axis of rotation (L) direction, said position being separated from the tip of the linear abrasive material (27) and the abrasive material holder (15). Each of the abrasive material bundles (11) is held by the abrasive material holder (15) and the parts of said abrasive material bundles (11) that are close to the abrasive material holder (15) are exposed on the outer peripheral side, thus making it easy for a cutting fluid or air supplied from the outer peripheral side of the polishing brush (1) to reach a part to be polished on a workpiece.

AKASHI MITSUHISA (JP)
SUMIYOSHI NORIHIKO (JP)

PCT/JP2014/078532

May 06, 2016

October 27, 2014

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TAIMEI CHEMICALS CO LTD (JP)
XEBEC TECHNOLOGY CO LTD (JP)

B24D13/14

WO2004009293A1

2004-01-29

JPH08229831A	1996-09-10
JPH09225106A	1997-09-02
JP2013141731A	2013-07-22

YOKOZAWA Shiro et al. (JP)
Shiro Yokozawa (JP)

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