Title:
POLISHING COMPOSITION FOR HARD MATERIALS
Document Type and Number:
WIPO Patent Application WO/2015/152383
Kind Code:
A1
Abstract:
Provided are: a polishing composition which enables polishing at a high polishing rate in cases where the polishing composition is used for the purpose of polishing an object that is formed of a hard material; and a method for producing a hard material using this polishing composition. A polishing composition according to the present invention is obtained by dispersing abrasive grains, which are formed of titanium diboride, in a dispersion. A method for producing a hard material according to the present invention comprises a step for polishing the surface of a hard material with use of this polishing composition.
Inventors:
ASHITAKA KEIJI (JP)
TOUJINBARA KAZUMA (JP)
MIWA NAOYA (JP)
TOUJINBARA KAZUMA (JP)
MIWA NAOYA (JP)
Application Number:
PCT/JP2015/060502
Publication Date:
October 08, 2015
Filing Date:
April 02, 2015
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
WO2009110231A1 | 2009-09-11 | |||
WO2009034924A1 | 2009-03-19 |
Foreign References:
JP2004508947A | 2004-03-25 | |||
JP2010522093A | 2010-07-01 | |||
JP2014508046A | 2014-04-03 | |||
JPH0741754A | 1995-02-10 | |||
JP2005518091A | 2005-06-16 |
Other References:
See also references of EP 3127984A4
Attorney, Agent or Firm:
ABE MAKOTO (JP)
Makoto Abe (JP)
Makoto Abe (JP)
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