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Patent Searching and Data


Title:
POLISHING COMPOSITION AND POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/163847
Kind Code:
A1
Abstract:
The present invention provides a polishing composition suitable for polishing a polishing subject having a layer that includes a group III-V compound, and with which it is possible to suppress etching of the group III-V compound and polish at a high polishing speed. The polishing composition of the present invention is used for applications that polish polishing subjects having a layer containing a group III-V compound, and contains abrasive grains, an oxidizing agent, and an anionic surfactant.

Inventors:
TADA MASAKI (JP)
Application Number:
PCT/JP2017/008825
Publication Date:
September 28, 2017
Filing Date:
March 06, 2017
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Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
WO2008047627A12008-04-24
WO2014184709A22014-11-20
Foreign References:
JP2013115155A2013-06-10
JP2015523716A2015-08-13
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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