Title:
POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/012173
Kind Code:
A1
Abstract:
The present invention provides a polishing composition which is capable of polishing an object to be polished, with high polishing speed, and few scratches (defects). This polishing composition includes silica of which the maximum peak height in the range of 25-250˚C inclusive in a weight change ratio distribution curve obtained by way of thermogravimetry, is at least -0.011, but less than 0. The polishing composition has a pH at 25˚C of less than 6.0.
Inventors:
SUZUKI SHOTA (JP)
IZAWA YOSHIHIRO (JP)
IZAWA YOSHIHIRO (JP)
Application Number:
PCT/JP2017/021691
Publication Date:
January 18, 2018
Filing Date:
June 12, 2017
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Foreign References:
| JP2008273780A | 2008-11-13 | |||
| JP2012111869A | 2012-06-14 | |||
| JP2008013655A | 2008-01-24 | |||
| JP2002080217A | 2002-03-19 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Download PDF: