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Patent Searching and Data


Title:
POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/012174
Kind Code:
A1
Abstract:
The present invention provides a polishing composition which is capable of polishing an object to be polished, with high polishing speed, and few scratches (defects). The present invention relates to a polishing composition which includes silica and a dispersion medium, wherein the relaxation speed ratio (R2sp) obtained by formula 1 (with the caveat that, R(silica) represents the reciprocal (in millisecond units) of the relaxation time of the silica, and R(medium) represents the reciprocal (in millisecond units) of the relaxation time of the dispersion medium), as measured using pulse nuclear magnetic resonance (NMR), is in the range of 1.60-4.20 inclusive.

Inventors:
SUZUKI, Shota (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
IZAWA, Yoshihiro (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
ISHIHARA, Naoyuki (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
Application Number:
JP2017/021692
Publication Date:
January 18, 2018
Filing Date:
June 12, 2017
Export Citation:
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Assignee:
FUJIMI INCORPORATED (1-1 Chiryo 2-chome, Nishibiwajima-cho Kiyosu-sh, Aichi 02, 〒4528502, JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
2011-02-24
2011-12-29
Foreign References:
JP2007153732A2007-06-21
Attorney, Agent or Firm:
HATTA & ASSOCIATES (Dia Palace Nibancho, 11-9 Nibancho, Chiyoda-k, Tokyo 84, 〒1020084, JP)
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