Title:
POLISHING COMPOSITION AND POLISHING METHOD USING SAME, AND SUBSTRATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/069714
Kind Code:
A1
Abstract:
Provided is a polishing composition used for polishing objects to be polished comprising a conductor layer and a conducting material layer adjacent to the conductor layer. In a state in which the positive electrode side of a potentiometer is connected to a conductive material layer and the negative electrode side of the potentiometer is connected to the conductor layer in the polishing composition at room temperature, the value of the current flowing from the positive electrode side to the negative electrode side when the conductive material layer and the conductor layer have been polished is shown to be a positive value or zero. This polishing composition preferably contains a nitrogen atom-containing compound, a sulphur atom-containing compound or a phosphorous atom-containing compound as an additive for making the value of the current to be a positive value or zero.
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Inventors:
KACHI YOSHIHIRO (JP)
TANAKA TOMOE (JP)
UMEDA TAKAHIRO (JP)
TANAKA TOMOE (JP)
UMEDA TAKAHIRO (JP)
Application Number:
PCT/JP2012/078913
Publication Date:
May 16, 2013
Filing Date:
November 08, 2012
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
| WO2010052983A1 | 2010-05-14 | |||
| WO2007043517A1 | 2007-04-19 |
Foreign References:
| JP2011503873A | 2011-01-27 | |||
| JP2007242970A | 2007-09-20 | |||
| JP2009094343A | 2009-04-30 | |||
| JP2003133268A | 2003-05-09 | |||
| US4944836A | 1990-07-31 | |||
| JP2011503873A | 2011-01-27 |
Other References:
See also references of EP 2779216A4
Attorney, Agent or Firm:
ONDA, Hironori et al. (JP)
Hironori Onda (JP)
Hironori Onda (JP)
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Claims: