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Patent Searching and Data


Title:
POLISHING COMPOSITION AND POLISHING METHOD USING SAME, AND METHOD FOR PRODUCING AN OBJECT INTENDED TO BE AND HAS BEEN POLISHED USING POLISHING COMPOSITION AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/061229
Kind Code:
A1
Abstract:
[Problem] The present invention provides a means capable of achieving a further improvement in polishing speed, for use in a polishing composition. [Solution] The polishing composition according to the present invention contains abrasive particles, hydrogen peroxide, and water, wherein the abrasive particles have an average secondary particle size of 20-150 nm, the mole concentration M (mmol/Kg) of the hydrogen peroxide and the total surface area of the abrasive particles satisfy formulae 1 and 2, and the pH of the polishing composition is 10-14. M < Log(S) × 100 - 750 (formula 1) M > 0 (formula 2) (wherein, S represents the total surface area (m2) of the abrasive particles contained in 1 kg of the polishing composition, and Log(S) represents the natural logarithm of S.)

Inventors:
SHINODA TOSHIO (JP)
UMEDA TAKAHIRO (JP)
SUZUKI SHOTA (JP)
Application Number:
PCT/JP2016/076530
Publication Date:
April 13, 2017
Filing Date:
September 08, 2016
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
WO2008004579A12008-01-10
WO2014175397A12014-10-30
Foreign References:
JP2007092064A2007-04-12
JP2003155471A2003-05-30
JP2004299018A2004-10-28
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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