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Patent Searching and Data


Title:
POLISHING COMPOSITION AND POLISHING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/150118
Kind Code:
A1
Abstract:
The present invention pertains to a polishing composition containing abrasive grains, a water-soluble polymer, an anionic surfactant, a basic compound, and water, the anionic surfactant having oxyalkylene units, and the average number of moles of the oxyalkylene units added to the anionic surfactant being greater than 3 and no greater than 25. The present invention makes it possible to provide a polishing composition having excellent polishing speed and being capable of reducing haze in the object to be polished.

Inventors:
TANIGUCHI MEGUMI (JP)
TSUCHIYA KOHSUKE (JP)
ASADA MAKI (JP)
ICHITSUBO TAIKI (JP)
TANSHO HISANORI (JP)
Application Number:
PCT/JP2017/004621
Publication Date:
September 08, 2017
Filing Date:
February 08, 2017
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
WO2015146282A12015-10-01
WO2012039390A12012-03-29
WO2012039390A12012-03-29
Foreign References:
JP2009218558A2009-09-24
JP2010095650A2010-04-30
JP2015007236A2015-01-15
JP2005123482A2005-05-12
JP2005268665A2005-09-29
JP2005268665A2005-09-29
US20050205837A12005-09-22
US20130183826A12013-07-18
Other References:
See also references of EP 3425016A4
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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