Title:
POLISHING COMPOSITION AND POLISHING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/130839
Kind Code:
A1
Abstract:
The present invention provides a means for decreasing a surface roughness (Ra) while keeping a high polishing speed in the polishing of an object comprising a resin and a filler. A polishing composition according to the present invention is intended to be used for the polishing of an object comprising a resin and a filler, the polishing composition comprising alumina particles, colloidal silica particles and a dispersion medium, in which the average particle diameter of the alumina particles is smaller than 2.8 μm and the average particle diameter of the colloidal silica particles is smaller than the average particle diameter of the alumina particles.
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Inventors:
WAKABAYASHI RYO (JP)
Application Number:
PCT/JP2021/041319
Publication Date:
June 23, 2022
Filing Date:
November 10, 2021
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
| WO2020122191A1 | 2020-06-18 | |||
| WO2019176558A1 | 2019-09-19 | |||
| WO2021131247A1 | 2021-07-01 |
Foreign References:
| JP2005187664A | 2005-07-14 | |||
| JP2012025873A | 2012-02-09 | |||
| JP2000248264A | 2000-09-12 | |||
| JP2016094510A | 2016-05-26 | |||
| JP2018199751A | 2018-12-20 | |||
| JP2016183212A | 2016-10-20 | |||
| US20150221521A1 | 2015-08-06 | |||
| JP2009206316A | 2009-09-10 | |||
| JP2002184726A | 2002-06-28 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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