POLISHING COMPOSITION AND POLISHING METHOD

WIPO Patent Application WO/2007/138975

A1

Disclosed is a polishing composition which enables a polishing wherein both high polishing rate and excellent step elimination are achieved for an object to be polished. Also disclosed is a polishing method which enables to quickly polish a wiring metal while suppressing increase in wiring resistance. The polishing method is also excellent in step elimination properties. Specifically disclosed is a polishing composition containing abrasive grains, an oxidizing agent, ammonium ions, polyvalent carboxylic acid ions, at least one chelating agent selected from the group consisting of pentaethylenehexamine, triethylenetetramine and tetraethylenepentamine, and an aqueous medium. Also disclosed is a polishing method wherein a wiring metal (3) is polished by using the polishing composition after forming a wiring groove (2) in a resin base (1) and filling the wiring groove (2) with the wiring metal (3).

KAMIYA, Hiroyuki (Limited 12-1, Yurakucho1-chome, Chiyoda-k, Tokyo 05, 1008405, JP)
神谷 広幸 (〒05 東京都千代田区有楽町一丁目１２番１号 旭硝子株式会社内 Tokyo, 1008405, JP)

JP2007/060610

December 06, 2007

May 24, 2007

Click for automatic bibliography generation  

ASAHI GLASS COMPANY, LIMITED (12-1, Yurakucho 1-chome Chiyoda-k, Tokyo 05, 1008405, JP)
旭硝子株式会社 (〒05 東京都千代田区有楽町一丁目１２番１号 Tokyo, 1008405, JP)
AGC SEIMI CHEMICAL CO., LTD. (3-2-10, Chigasaki Chigasaki-sh, Kanagawa 85, 2538585, JP)
ＡＧＣセイミケミカル株式会社 (〒85 神奈川県茅ヶ崎市茅ヶ崎三丁目２番１０号 Kanagawa, 2538585, JP)

B24B37/00; C09K3/14; H01L21/304

SENMYO, Kenji et al. (4th Floor, SIA Kanda Square17, Kanda-konyacho,Chiyoda-k, Tokyo 35, 1010035, JP)

View/Download PDF      PDF Help

Previous Patent: PROCESS FOR PRODUCING LOADING PIGMENT DISPERSION FOR OIL-BASED-INK PRINTING, LOADING PIGMENT DISPERS...

Next Patent: DISPLAY CONTROL DEVICE, DISPLAY CONTROL METHOD, AND INTEGRATED CIRCUIT