POLISHING COMPOSITION, AND POLISHING METHOD

Title:

POLISHING COMPOSITION, AND POLISHING METHOD

Document Type and Number:

WIPO Patent Application WO/2018/124229

Kind Code:

A1

Abstract:

Provided is a polishing composition which is capable of further reducing microdefects and haze on polished wafers. The polishing composition includes silica particles, a basic compound, and polyglycerol. The mass ratio of silica to polyglycerol is not more than 0.9. The basic compound may be at least one compound selected from hydroxides of alkali metals, salts of alkali metals, ammonia, amines, ammonium salts, and quaternary ammonium hydroxides. It is preferable that the polishing composition further include a polyhydric alcohol which is a nonionic surfactant.

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Inventors:

SUGITA NORIAKI (JP)
MATSUSHITA TAKAYUKI (JP)

Application Number:

PCT/JP2017/047085

Publication Date:

July 05, 2018

Filing Date:

December 27, 2017

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Assignee:

NITTA HAAS INC (JP)

International Classes:

C09K3/14; B24B37/00; C09G1/02; H01L21/304

Domestic Patent References:

WO2013157442A1

2013-10-24

Foreign References:

JP2015109423A	2015-06-11
JP2014187268A	2014-10-02

Attorney, Agent or Firm:

UEBA Hidetoshi et al. (JP)

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