Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLISHING COMPOSITION AND RINSING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2004/042812
Kind Code:
A1
Abstract:
A polishing composition and a rinsing composition which effectively prevent a wafer from being contaminated by metal impurities are disclosed. The polishing composition contains a chelating agent, an alkali compound, a silicon dioxide and water. The rinsing composition contains a chelating agent, an alkali compound and water. The chelating agent contained in the polishing composition and the rinsing composition is an acid represented by the following chemical formula (1) or its salt. In the chemical formula (1), Y2 and Y3 respectively represent an alkylene group, n is an integer of 0 to 4, and 4+n substituents expressed by R8-R12 respectively represent an alkyl group. At least four alkyl groups have a phosphonic acid group.

Inventors:
KAWASE AKIHIRO (JP)
MIWA TOSHIHIRO (JP)
SAKAMOTO KENJI (JP)
HAYASHIDA ICHIRO (JP)
Application Number:
PCT/JP2003/014224
Publication Date:
May 21, 2004
Filing Date:
November 07, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIMI INC (JP)
WAKO PURE CHEM IND LTD (JP)
KAWASE AKIHIRO (JP)
MIWA TOSHIHIRO (JP)
SAKAMOTO KENJI (JP)
HAYASHIDA ICHIRO (JP)
International Classes:
C09G1/02; C09K3/14; C11D7/20; C11D7/36; C11D11/00; H01L21/02; H01L21/306; (IPC1-7): H01L21/304; C09K3/14
Domestic Patent References:
WO2001004231A12001-01-18
Foreign References:
EP0789071A11997-08-13
JPH11116984A1999-04-27
JP2001308052A2001-11-02
JP2001131535A2001-05-15
Other References:
See also references of EP 1564797A4
Attorney, Agent or Firm:
Onda, Hironori (Ohmiya-cho 2-chome Gifu-shi, Gifu, JP)
Download PDF: