POLISHING COMPOSITION AND POLISHING COMPOSITION SET

WIPO Patent Application WO/2018/043504

A1

Provided is a polishing composition which is effective for reducing surface defects. A polishing composition according to the present invention contains abrasive grains, a water-soluble polymer and a basic compound. The water-soluble polymer contains a polymer A that satisfies both of the conditions (1) and (2) described below. (1) Each molecule contains a vinyl alcohol unit and a non-vinyl alcohol unit. (2) The adsorption parameter as calculated by [(C1 - C2)/C1] × 100 is 5 or more. In the formula, C1 represents the total amount of organic carbon contained in test liquid L1 that contains 0.017% by weight of the polymer A and 0.009% by weight of ammonia; and C2 represents the total amount of organic carbon contained in a supernatant which is obtained by subjecting a test liquid L2 that contains 0.46% by weight of a colloidal silica having a BET diameter of 35 nm, 0.017% by weight of the polymer A and 0.009% by weight of ammonia to centrifugal separation, thereby having the abrasive grains settle out.

JP2012011514	SLURRY COMPOSITION FOR POLISHING PROCESSING, SEMICONDUCTOR SUBSTRATE, AND COMPOSITE MATERIAL FORMED OF DIFFERENT HARDNESS MATERIAL
JPS5657869	FRICTION MATERIAL

TSUCHIYA KOHSUKE (JP)
TANSHO HISANORI (JP)
ICHITSUBO TAIKI (JP)
ASADA MAKI (JP)

PCT/JP2017/031008

March 08, 2018

August 29, 2017

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FUJIMI INC (JP)
TOAGOSEI CO LTD (JP)

C09K3/14; B24B37/00; H01L21/304

WO2014030570A1	2014-02-27
WO2013137212A1	2013-09-19
WO2014148399A1	2014-09-25

JP2014038906A	2014-02-27
JP2014116557A	2014-06-26
JP2009147267A	2009-07-02
JP2015109423A	2015-06-11
JP2016056220A	2016-04-21
JP2006186356A	2006-07-13

See also references of EP 3508550A4

ABE, Makoto (JP)

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