Title:
POLISHING COMPOSITION FOR SILICON WAFERS AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/113986
Kind Code:
A1
Abstract:
To provide a novel polishing composition suited to polishing. Provided is polishing composition for silicon wafers. The polishing composition contains a basic compound, a surfactant, and water. The surfactant is an acetylene-glycol-type compound having one acetylene group per molecule and moreover is a compound to which an alkylene oxide has furthermore been added.
Inventors:
GOTO OSAMU (JP)
TAKAMA DAIKI (JP)
TSUCHIYA KOHSUKE (JP)
TAKAMA DAIKI (JP)
TSUCHIYA KOHSUKE (JP)
Application Number:
PCT/JP2021/042940
Publication Date:
June 02, 2022
Filing Date:
November 24, 2021
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Foreign References:
| JP6761554B1 | 2020-09-23 | |||
| JP2007273642A | 2007-10-18 | |||
| US20130244432A1 | 2013-09-19 |
Other References:
ANONYMOUS: "Nissin chemical industry company", SHIN ETSU, 1 January 2019 (2019-01-01), pages 1 - 4, XP055932543
Attorney, Agent or Firm:
ABE, Makoto (JP)
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