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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2008/013226
Kind Code:
A1
Abstract:
Disclosed is a polishing composition which realizes both high planarity and reduction of corrosion in the surface of a wiring metal. Specifically disclosed is a polishing composition containing an oxidizing agent (A), at least one or more acids (B) selected from amino acids, carboxylic acids having 8 or less carbon atoms and inorganic acids, a sulfonic acid (C) having a concentration of not less than 0.01% by mass and an alkyl group having 8 or more carbon atoms, a fatty acid (D) having a concentration of not less than 0.001% by mass and an alkyl group having 8 or more carbon atoms, and at least one or more compounds (E) selected from pyridinecarbonyl compounds, nonionic water-soluble polymers, 2-pyrrolidone, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, gramine, adenine, N,N'-diisopropylethylenediamine, N,N'-bis(2-hydroxyethyl)ethylenediamine, N,N'-dibenzylethylenediamine and N,N'-diphenylethylenediamine.

Inventors:
SATO, Takashi (Shiojiri Plant 1, Oaza Soga, Shiojiri-sh, Nagano 61, 3996461, JP)
佐藤 孝志 (〒61 長野県塩尻市大字宗賀1番地 昭和電工株式会社 塩尻事業所内 Nagano, 3996461, JP)
TAKAHASHI, Hiroshi (Shiojiri Plant 1, Oaza Soga, Shiojiri-sh, Nagano 61, 3996461, JP)
高橋 浩 (〒61 長野県塩尻市大字宗賀1番地 昭和電工株式会社 塩尻事業所内 Nagano, 3996461, JP)
Application Number:
JP2007/064671
Publication Date:
January 31, 2008
Filing Date:
July 26, 2007
Export Citation:
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Assignee:
SHOWA DENKO K.K. (13-9, Shibadaimon 1-chome Minato-k, Tokyo 18, 1058518, JP)
昭和電工株式会社 (〒18 東京都港区芝大門一丁目13番9号 Tokyo, 1058518, JP)
SATO, Takashi (Shiojiri Plant 1, Oaza Soga, Shiojiri-sh, Nagano 61, 3996461, JP)
佐藤 孝志 (〒61 長野県塩尻市大字宗賀1番地 昭和電工株式会社 塩尻事業所内 Nagano, 3996461, JP)
TAKAHASHI, Hiroshi (Shiojiri Plant 1, Oaza Soga, Shiojiri-sh, Nagano 61, 3996461, JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
SHIGA, Masatake et al. (2-3-1, Yaesu Chuo-k, Tokyo 53, 1048453, JP)
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