Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/096331
Kind Code:
A1
Abstract:
Disclosed is a polishing composition which has a high SiOx (0
Inventors:
TANAKA Rika (3-17-1 Kannabidai, Kyotanabe-sh, Kyoto 33, 〒6100333, JP)
Application Number:
JP2011/051701
Publication Date:
August 11, 2011
Filing Date:
January 28, 2011
Export Citation:
Assignee:
NITTA HAAS INCORPORATED (4-26, Sakuragawa 4-chome Naniwa-ku, Osaka-sh, Osaka 22, 〒5560022, JP)
ニッタ・ハース株式会社 (〒22 大阪府大阪市浪速区桜川４丁目４番２６号 Osaka, 〒5560022, JP)
ニッタ・ハース株式会社 (〒22 大阪府大阪市浪速区桜川４丁目４番２６号 Osaka, 〒5560022, JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
UEBA Hidetoshi et al. (Intelix International, Aqua Dojima West 4-16, Dojimahama 1-chome, Kita-ku, Osaka-sh, Osaka 04, 〒5300004, JP)
Claims:
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