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Patent Searching and Data


Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/099866
Kind Code:
A1
Abstract:
This polishing composition is used for polishing a polishing subject having a metal portion or an interlayer insulating film, the polishing composition being characterized in containing an oxidant and silica in which organic acids such as sulfonic acid or carboxylic acid are immobilized.

Inventors:
YOKOTA SHUUGO (JP)
KACHI YOSHIHIRO (JP)
AKATSUKA TOMOHIKO (JP)
Application Number:
PCT/JP2012/083472
Publication Date:
July 04, 2013
Filing Date:
December 25, 2012
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Foreign References:
JP2011165759A2011-08-25
JP2004534396A2004-11-11
JP2010074196A2010-04-02
JP2009049401A2009-03-05
JP2009152647A2009-07-09
JP2007207785A2007-08-16
JP2010269985A2010-12-02
Other References:
"Sulfonic acid-functionalized silica through quantitative oxidation of thiol groups", CHEM. COMMUN., 2003, pages 246 - 247
"Novel Silane Coupling Agents Containing a Photolabile 2-Nitrobenzyl Ester for Introduction of a Carboxy Group on the Surface of Silica Gel", CHEMISTRY LETTERS, vol. 3, 2000, pages 228 - 229
See also references of EP 2800124A4
Attorney, Agent or Firm:
ONDA, Hironori et al. (JP)
Hironori Onda (JP)
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Claims: