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Patent Searching and Data


Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/158324
Kind Code:
A1
Abstract:
[Problem] The present invention addresses the problem of providing a polishing composition which has a sufficiently improved polishing rate for an object to be polished which has a silicon-oxygen bond, such as a silicon oxide film, or a sufficiently improved polishing rate for an object to be polished which has a silicon-nitrogen bond, such as a silicon nitride film. [Solution] Provided is a polishing composition which comprises (1) an organic compound, (2) abrasive grains and (3) a dispersion medium, wherein the organic compound has an action site capable of interacting with an object to be polished which has a silicon-oxygen bond or a silicon-nitrogen bond and a promotion site capable of promoting the access of a polishing component for polishing the object to the object.

Inventors:
ONISHI SHOGO (JP)
SATO TAKEKI (JP)
YOSHIZAKI YUKINOBU (JP)
SAKABE KOICHI (JP)
Application Number:
PCT/JP2016/057837
Publication Date:
October 06, 2016
Filing Date:
March 11, 2016
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
WO2009154164A12009-12-23
Foreign References:
JP2011216581A2011-10-27
JP2012040671A2012-03-01
JP2015516476A2015-06-11
JP2010041037A2010-02-18
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Hatta international patent business corporation (JP)
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