Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/181888
Kind Code:
A1
Abstract:
The present invention relates to a polishing composition which is favorably used in polishing primarily semiconductor substrates of silicon wafers, etc., and other objects to be polished, and which can obtain an excellent overall shape. Defining Wp as the conformability of the polishing composition to a polishing pad, Ww as conformability thereof to an object to be polished, and Wc as conformability to a tool for holding the object to be polished, it holds that Wp ≧ Wc or Ww ≧ Wc ≧ Wp.
Inventors:
ODA HIROYUKI (JP)
TAKAHASHI SHUHEI (JP)
MORI YOSHIO (JP)
TAKAMI SHINICHIRO (JP)
TABATA MAKOTO (JP)
TAKAHASHI SHUHEI (JP)
MORI YOSHIO (JP)
TAKAMI SHINICHIRO (JP)
TABATA MAKOTO (JP)
Application Number:
PCT/JP2016/063597
Publication Date:
November 17, 2016
Filing Date:
May 02, 2016
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| WO2010122985A1 | 2010-10-28 |
Foreign References:
| JP2008053415A | 2008-03-06 | |||
| KR20050050351A | 2005-05-31 | |||
| KR20060019257A | 2006-03-03 |
Other References:
See also references of EP 3296376A4
Attorney, Agent or Firm:
MORI Tetsuya et al. (JP)
Woods Tetsuya (JP)
Woods Tetsuya (JP)
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