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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/002705
Kind Code:
A1
Abstract:
Provided is a polishing composition for polishing a material having a Vickers hardness not lower than 1500 Hv. This polishing composition contains first alumina abrasive grains having an average secondary-particle diameter D2f and second alumina abrasive grains having an average secondary-particle diameter D2s which is smaller than that of the first alumina abrasive grains.

Inventors:
TAKAHASHI SHUHEI (JP)
TOMATSU MASATOSHI (JP)
Application Number:
PCT/JP2016/068701
Publication Date:
January 05, 2017
Filing Date:
June 23, 2016
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
WO2013133198A12013-09-12
WO2012115020A12012-08-30
WO2008105342A12008-09-04
WO2014061417A12014-04-24
Foreign References:
JP2009144080A2009-07-02
JP2005023266A2005-01-27
JP2011121151A2011-06-23
Attorney, Agent or Firm:
ABE Makoto (JP)
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