Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/047307
Kind Code:
A1
Abstract:
Provided is a polishing composition in which the ratio of the rate of polishing polysilicon or amorphous silicon to the rate of polishing silicon nitride is high, the rate of polishing polysilicon or amorphous silicon is high, and the rate of polishing silicon nitride is low. The polishing composition comprises abrasive grains, a quaternary ammonium salt having a benzene ring in the structure, and a water-soluble polymer and/or a surfactant. This polishing composition is for use in polishing a work which includes polysilicon and/or amorphous silicon and further includes silicon nitride.
Inventors:
PAN YIMIN (JP)
Application Number:
PCT/JP2016/073745
Publication Date:
March 23, 2017
Filing Date:
August 12, 2016
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
| WO2008105223A1 | 2008-09-04 |
Foreign References:
| JP2014515777A | 2014-07-03 | |||
| JP2005101545A | 2005-04-14 | |||
| JP2004266155A | 2004-09-24 | |||
| JP2004247542A | 2004-09-02 | |||
| JP2011216873A | 2011-10-27 | |||
| JP2016017149A | 2016-02-01 |
Attorney, Agent or Firm:
MORI Tetsuya et al. (JP)
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