Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/130749
Kind Code:
A1
Abstract:
A polishing composition including abrasive grains, an additive, and a water-soluble polymer, wherein the polishing composition has a ratio of D50 (after) to D50 (before) of less than 2.0; here, D50 (before) is the D50 value of particles of the polishing composition measured before allowing the polishing composition to stand for five days at 80°C, and D50 (after) is the D50 value of particles of the polishing composition measured after allowing the polishing composition to stand for five days at 80°C.

More Like This:
JP2009065001AQUEOUS DISPERSANT FOR CHEMICAL MECHANICAL POLISHING, KIT FOR PREPARING THE SAME, AND PREPARING METHOD FOR THE SAME
JPH09278553PRODUCTION OF CARBON COMPOSITE MATERIAL REINFORCED WITH CARBON FIBER
JP4294710Cerium oxide and its manufacturing method
Inventors:
TAKEDA HISASHI (US)
GRANDSTROM JIMMY ERIK (US)
SAEKI FUSAYO (US)
Application Number:
PCT/JP2017/001094
Publication Date:
August 03, 2017
Filing Date:
January 13, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Foreign References:
JP2013038237A2013-02-21
JP2009302255A2009-12-24
JP2010153576A2010-07-08
JP2007123826A2007-05-17
JP2015025108A2015-02-05
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: STENT

Next Patent: METHOD OF DECODING BASE SEQUENCE OF NUCLEIC ACIDS CORRESPONDING TO RNA TERMINAL REGION, AND METHOD O...