Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/170062
Kind Code:
A1
Abstract:
Provided is a polishing composition for polishing materials to be polished having a Vickers hardness of at least 1500 Hv. This polishing composition contains alumina abrasive and water. The isoelectric point of the alumina abrasive is less than 8.0, and the alumina abrasive has a lower pH than that of the polishing composition.
Inventors:
ISHIBASHI TOMOAKI (JP)
Application Number:
PCT/JP2017/011527
Publication Date:
October 05, 2017
Filing Date:
March 22, 2017
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| WO2012115020A1 | 2012-08-30 | |||
| WO2016043089A1 | 2016-03-24 | |||
| WO2016043088A1 | 2016-03-24 | |||
| WO2015170743A1 | 2015-11-12 |
Foreign References:
| JP2005159166A | 2005-06-16 | |||
| JP2004342751A | 2004-12-02 | |||
| JP2009028814A | 2009-02-12 | |||
| JP2015011735A | 2015-01-19 |
Attorney, Agent or Firm:
ABE Makoto (JP)
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