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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/187749
Kind Code:
A1
Abstract:
[Problem] To provide a means for improving the dispersibility of abrasive grains while maintaining the polishing performance, and to provide a means for improving the redispersibility of abrasive grains while maintaining the polishing performance. [Solution] A polishing composition which comprises abrasive grains, a phyllosilicate compound, and a dispersion medium.

Inventors:
TENKOU, Kyousuke (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
Application Number:
JP2017/006954
Publication Date:
November 02, 2017
Filing Date:
February 23, 2017
Export Citation:
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Assignee:
FUJIMI INCORPORATED (1-1 Chiryo 2-chome, Nishibiwajima-cho Kiyosu-sh, Aichi 02, 〒4528502, JP)
International Classes:
C09K3/14; B24B37/00
Foreign References:
JP2011507998A2011-03-10
JP2000017251A2000-01-18
JPS62297062A1987-12-24
JP2008502776A2008-01-31
JPH08209117A1996-08-13
JP2015203080A2015-11-16
Attorney, Agent or Firm:
HATTA & ASSOCIATES (Dia Palace Nibancho, 11-9 Nibancho, Chiyoda-k, Tokyo 84, 〒1020084, JP)
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