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Patent Searching and Data


Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/191671
Kind Code:
A1
Abstract:
Provided is a polishing composition capable of polishing a sapphire wafer at an excellent polishing rate. The polishing composition contains silica particles, a glycol ether compound, and water. The content of glycol ether compound in the polishing composition is 0.1 mass percent to 10 mass percent inclusive.

Inventors:
EZAWA, Shunji (3-17-1 Kannabidai, Kyotanabe-sh, Kyoto 33, 〒6100333, JP)
DAITO, Takeshi (3-17-1 Kannabidai, Kyotanabe-sh, Kyoto 33, 〒6100333, JP)
CHINEN, Mika (3-17-1 Kannabidai, Kyotanabe-sh, Kyoto 33, 〒6100333, JP)
MORIYAMA, Kazuki (3-17-1 Kannabidai, Kyotanabe-sh, Kyoto 33, 〒6100333, JP)
Application Number:
JP2016/063549
Publication Date:
November 09, 2017
Filing Date:
May 02, 2016
Export Citation:
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Assignee:
NITTA HAAS INCORPORATED (4-26, Sakuragawa 4-chome Naniwa-ku, Osaka-sh, Osaka 22, 〒5560022, JP)
International Classes:
C09K3/14; B24B37/00
Foreign References:
JP2006269908A2006-10-05
JP2006159322A2006-06-22
CN102061133A2011-05-18
CN102453439A2012-05-16
JP2004349608A2004-12-09
Attorney, Agent or Firm:
UEBA Hidetoshi et al. (INTELIX Patent & Law Firm, Dojima Axis Building 2-28, Dojimahama 2-chome, Kita-ku, Osaka-sh, Osaka 04, 〒5300004, JP)
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