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Patent Searching and Data


Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/147148
Kind Code:
A1
Abstract:
Provided are: a polishing composition which can achieve both of a high polishing rate and a reduced edge roll-off amount while reducing an abrasive grain content; and a polishing composition which can produce a polished surface having good flatness and having a small difference in thickness between a near-edge part of a polished object and the center part of the polished object. Each of the polishing compositions provided herein comprises abrasive grains, water and an amine compound containing no ether bond, wherein the amine compound satisfies at least one of requirements (1) and (2) as mentioned below and the abrasive grain content in the polishing composition is 2% by weight or less: (1) the compound has a hydrocarbon group having at least three carbon atoms between two primary amino groups in the molecule and has no ether bond; and (2) the compound has a primary amino group and at least one of a secondary amino group and a tertiary amino group and has no ether bond. Alternatively, the polishing composition provided herein comprises abrasive grains, water, a roll-up amine compound A and a roll-off compound B.

Inventors:
KON HIROKI (JP)
TANIGUCHI MEGUMI (JP)
TSUCHIYA KOHSUKE (JP)
MUKAI TAKATOSHI (JP)
NUMATA KEISUKE (JP)
Application Number:
PCT/JP2018/003326
Publication Date:
August 16, 2018
Filing Date:
February 01, 2018
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Foreign References:
JP2011258825A2011-12-22
JP2016124943A2016-07-11
JP2016084371A2016-05-19
JP2016023216A2016-02-08
JP2014194016A2014-10-09
JP2014509073A2014-04-10
Attorney, Agent or Firm:
ABE, Makoto (JP)
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