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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/176558
Kind Code:
A1
Abstract:
A polishing composition for polishing resin, wherein: the polishing composition contains alumina abrasive grains, a dispersant, and water; and the ratio of the primary average particle size of the alumina particles in the alumina abrasive grains and the average particle size of the alumina particles measured by dynamic light scattering is 1:6.0-1:100.

Inventors:
MORIYAMA KAZUKI (JP)
Application Number:
PCT/JP2019/007787
Publication Date:
September 19, 2019
Filing Date:
February 28, 2019
Export Citation:
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Assignee:
NITTA HAAS INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304; H05K3/00
Domestic Patent References:
WO2016208301A12016-12-29
WO2009151120A12009-12-17
Foreign References:
KR20040052355A2004-06-23
JP2000028819A2000-01-28
JP2004022748A2004-01-22
JP2009129977A2009-06-11
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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