Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/188359
Kind Code:
A1
Abstract:
The present invention provides a means whereby a work can be polished at a high rate and have a further improved surface quality. The present invention is a polishing composition for use in polishing works which comprises abrasive alumina grains and a dispersion medium, wherein the abrasive alumina grains comprise crystalline alumina consisting only of α-alumina A, which has an α-alumina structure content of 80% or higher, and α-alumina B, which has an α-alumina structure content less than 80%, the α-alumina A having a smaller average grain diameter than the α-alumina B.
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Inventors:
KON HIROKI (JP)
Application Number:
PCT/JP2019/010632
Publication Date:
October 03, 2019
Filing Date:
March 14, 2019
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| WO2011136387A1 | 2011-11-03 |
Foreign References:
| JP2011121151A | 2011-06-23 | |||
| JP2015120816A | 2015-07-02 | |||
| JP2009163808A | 2009-07-23 | |||
| US20120115020A1 | 2012-05-10 | |||
| US20130324015A1 | 2013-12-05 | |||
| JP2015120816A | 2015-07-02 | |||
| JP2011121151A | 2011-06-23 | |||
| JP2018061561A | 2018-04-19 |
Other References:
See also references of EP 3778823A4
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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