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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/189124
Kind Code:
A1
Abstract:
Provided is a polishing composition that has excellent ability to eliminate bulging around an HLM. This polishing composition is for pre-polishing a silicon substrate. The polishing composition includes abrasive grains, a basic compound, a surfactant, and water. According to one favorable embodiment, the polishing composition includes, as the surfactant, a surfactant A1 that has a quaternary ammonium betaine structure. According to another favorable embodiment, the polishing composition includes, as the surfactant, a surfactant A2 that includes a quaternary ammonium salt structure but does not include an oxyalkylene structure.

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Inventors:
TANIGUCHI MEGUMI (JP)
MUKAI TAKATOSHI (JP)
TSUCHIYA KOHSUKE (JP)
Application Number:
PCT/JP2019/012773
Publication Date:
October 03, 2019
Filing Date:
March 26, 2019
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
WO2018193916A12018-10-25
Foreign References:
JP2016215336A2016-12-22
JP2017190363A2017-10-19
JP2013251561A2013-12-12
Attorney, Agent or Firm:
ABE, Makoto (JP)
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