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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/162144
Kind Code:
A1
Abstract:
Provided is a polishing composition which can achieve both a high polishing rate and excellent protrusion elimination properties at a periphery of an HLM. The polishing composition provided by the present invention is used in a preliminary polishing step for a silicon substrate. This polishing composition contains abrasive grains, a basic compound and a nitrogen-containing organic compound A. At least one nitrogen atom contained in the nitrogen-containing organic compound A forms a π-conjugated structure.

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Inventors:
TANABE YOSHIYUKI (JP)
TANIGUCHI MEGUMI (JP)
Application Number:
PCT/JP2020/001646
Publication Date:
August 13, 2020
Filing Date:
January 20, 2020
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
WO2015019706A12015-02-12
Foreign References:
JP2018053147A2018-04-05
JP2015191966A2015-11-02
JP2011086713A2011-04-28
Attorney, Agent or Firm:
ABE, Makoto (JP)
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