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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/138103
Kind Code:
A1
Abstract:
The present invention provides a means capable of achieving a high polishing speed when polishing a silicon wafer.　The present invention relates to a polishing composition used to polish a silicon wafer, the polishing composition comprising: a nitrogen-containing organic compound having a highest occupied molecular orbital (HOMO) energy level of at least -9.50 eV; and water.

Inventors:
TANABE YOSHIYUKI (JP)
Application Number:
PCT/JP2021/044672
Publication Date:
June 30, 2022
Filing Date:
December 06, 2021
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
B24B37/00; H01L21/304
Domestic Patent References:
WO2008093450A12008-08-07
WO2017150158A12017-09-08
WO2015102101A12015-07-09
Foreign References:
JP2014505358A2014-02-27
JP2018049980A2018-03-29
JP2011258825A2011-12-22
JP2020212274A
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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