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Title:
POLISHING COMPOSITIONS FOR SILICON CARBIDE SURFACES AND METHODS OF USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/106358
Kind Code:
A1
Abstract:
The present disclosure relates to chemical-mechanical polishing (CMP) compositions for polishing polycrystalline silicon carbide-containing surfaces. More particularly, the polishing compositions are in the form of a slurry with a pH of 8 or more comprising an oxidant and an abrasive.

Inventors:
HIRANO SHINYA (US)
GARRETSON JEREMY (US)
YAMAMOTO YUSUKE (US)
Application Number:
PCT/JP2022/045243
Publication Date:
June 15, 2023
Filing Date:
December 08, 2022
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
WO2009111001A22009-09-11
Foreign References:
US20190185715A12019-06-20
US20170321098A12017-11-09
US20200399505A12020-12-24
US20190367776A12019-12-05
CN104835731A2015-08-12
CN105315893A2016-02-10
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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