POLISHING COMPOUND, METHOD FOR PRODUCTION THEREOF AND POLISHING METHOD

Title:

POLISHING COMPOUND, METHOD FOR PRODUCTION THEREOF AND POLISHING METHOD

Document Type and Number:

WIPO Patent Application WO/2003/036705

Kind Code:

A1

Abstract:

A method for producing a polishing compound, which comprises dissolving a heterocyclic benzene compound such as benzotriazole in one or more organic solvents selected from the group consisting of a primary alcohol having 1 to 4 carbon atoms, a glycol having 2 to 4 carbon atoms, an ether represented by CH₃CH(OH)CH₂OC_mH_{2m&plus 1}, wherein m is an integer of 1 to 4, N−methyl−2−pyrrolidone, N,N−dimethylformamide, dimethyl sulfoxide, &gammad −butyloractone and propylene carbonate, and then mixing the resulting solution with an aqueous dispersion of fine oxide particles as abrasive grains&semi and a polishing compound produced by the method. The use of the polishing compound for polishing a substrate having an insulating film (2) and, formed thereon, a wiring metal film (4) and a barrier film (3) allows the formation of an embedded wiring (5) being reduced in dishing, in erosion, and in scratch, with high polishing speed.

Inventors:

TAKEMIYA SATOSHI (JP)
NAKAZAWA NORIHITO (JP)
KON YOSHINORI (JP)

Application Number:

PCT/JP2002/010996

Publication Date:

May 01, 2003

Filing Date:

October 23, 2002

Export Citation:

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Assignee:

ASAHI GLASS CO LTD (JP)
SEIMI CHEM KK (JP)
TAKEMIYA SATOSHI (JP)
NAKAZAWA NORIHITO (JP)
KON YOSHINORI (JP)

International Classes:

B24B37/00; C09G1/02; H01L21/321; (IPC1-7): H01L21/304; B24B37/00; C09K3/14

Foreign References:

JP2001031950A	2001-02-06
US5897375A	1999-04-27
US5895509A	1999-04-20
JP2001185515A	2001-07-06

Other References: