Title:
POLISHING DEVICE, POLISHING METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/054562
Kind Code:
A1
Abstract:
A polishing device (10) comprises: a wafer-holding part (31) that holds a wafer (W) and brings the held wafer (W) into contact with a polishing surface (22a); a surface plate drive unit (24) or a head drive unit (34) that rotates the wafer-holding part (31) relative to the polishing surface (22a) to which a slurry (SL) is supplied when polishing the wafer (W); a polishing pressure application part (32) that applies a polishing pressure to the wafer (W) by pressing the wafer (W) against the polishing surface (22a) with the wafer-holding part (31) therebetween; and a control unit (50) that periodically switches the state of the polishing pressure applied to the wafer (W) via the polishing pressure application part (32) during polishing of the wafer (W) between a high-pressure state and a low-pressure state in which the polishing pressure is lower than in the high-pressure state.
Inventors:
AIDA HIDEO (JP)
KATAKURA HARUJI (JP)
OMIYA NATSUKO (JP)
KOBORI YASUYUKI (JP)
KATAKURA HARUJI (JP)
OMIYA NATSUKO (JP)
KOBORI YASUYUKI (JP)
Application Number:
PCT/JP2022/036377
Publication Date:
April 06, 2023
Filing Date:
September 29, 2022
Export Citation:
Assignee:
SANOH IND CO LTD (JP)
NATIONAL UNIV CORPORATION NAGAOKA UNIV OF TECHNOLOGY (JP)
HITECHNOTH CORP (JP)
NATIONAL UNIV CORPORATION NAGAOKA UNIV OF TECHNOLOGY (JP)
HITECHNOTH CORP (JP)
International Classes:
B24B37/005; B24B37/00; B24B37/30; H01L21/304
Foreign References:
| JPH1126405A | 1999-01-29 | |||
| JPH03213268A | 1991-09-18 | |||
| JP2017112302A | 2017-06-22 | |||
| JP2021161159A | 2021-10-11 |
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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