Title:
POLISHING DEVICE AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/019661
Kind Code:
A1
Abstract:
The polishing device (1) is provided with: a processing vessel (10) into which the workpieces are inserted; a mobilization unit for mobilizing the workpieces inside the processing vessel; an abrasive-charging unit (30) for charging the abrasive in the direction of the workpieces; and a suction unit (40) for generating an air flow in which the abrasive moves in the direction that passes through the processing vessel (10) and for recovering the abrasive by suction. As a result of the air flow generated by the suction unit (40), the abrasive charged from the abrasive-charging unit (30) passes between the workpieces inserted in the processing vessel (10) while contacting the workpieces. The workpieces are thereby polished.
Inventors:
MAEDA KAZUYOSHI (JP)
SHIBUYA NORIHITO (JP)
SHIBUYA NORIHITO (JP)
Application Number:
PCT/JP2014/058508
Publication Date:
February 12, 2015
Filing Date:
March 26, 2014
Export Citation:
Assignee:
SINTOKOGIO LTD (JP)
International Classes:
B24B31/00; B24B31/02; B24B31/06; B24C3/26; H01F41/04; H01G13/00
Domestic Patent References:
| WO2013105301A1 | 2013-07-18 |
Foreign References:
| JPH07100767A | 1995-04-18 | |||
| EP1825956A1 | 2007-08-29 | |||
| JP2008194792A | 2008-08-28 | |||
| JP2005313262A | 2005-11-10 | |||
| JP2010502461A | 2010-01-28 | |||
| JP2002301664A | 2002-10-15 |
Other References:
See also references of EP 3017912A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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