Title:
POLISHING DEVICE AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/172683
Kind Code:
A1
Abstract:
The present invention relates to a polishing device and a polishing method for polishing a planar section of a substrate such as a wafer. This polishing device (100) comprises a substrate-holding part that holds a substrate (W) and that causes the wafer W to rotate, a polishing tape supply mechanism (141) that feeds a polishing tape (3) in the longitudinal direction thereof, and at least one polishing head (10) that is disposed in contact with a planar section of the substrate (W), the polishing head (10) having a fluid-pressing part (12) that presses the polishing tape (3) against the planar part of the substrate by using a fluid, and the fluid-pressing part (12) having a fluid supply port (13) disposed facing the reverse surface of the polishing tape (3).
Inventors:
YAMAMOTO SATORU (JP)
UCHIYAMA KEISUKE (JP)
IZAWA MAO (JP)
KASHIWAGI MAKOTO (JP)
UCHIYAMA KEISUKE (JP)
IZAWA MAO (JP)
KASHIWAGI MAKOTO (JP)
Application Number:
PCT/JP2022/001028
Publication Date:
August 18, 2022
Filing Date:
January 14, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B21/08; B24B9/00; B24B21/00; H01L21/304
Foreign References:
| JPH05151565A | 1993-06-18 | |||
| JPH11232646A | 1999-08-27 | |||
| JP2002245669A | 2002-08-30 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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