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Patent Searching and Data


Title:
POLISHING DEVICE AND WAFER POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/063457
Kind Code:
A1
Abstract:
The present invention is an index-type polishing device that is provided with a polishing head that is for holding a wafer, with a plurality of surface plates to which are stuck a polishing cloth that is for polishing the wafer, and with a loading/unloading stage that is for loading the wafer onto the polishing head or peeling the wafer away from the polishing head. By turning the polishing head, the polishing device polishes the wafer that is held by the polishing head while switching the surface plate that is used to polish the wafer. The polishing device is characterized by having a surface plate vertical motion mechanism that can vertically move the surface plates. As a result, the present invention can reduce the amount of deformation that occurs during polishing when a moment load is applied to the polishing head.

Inventors:
SATO MICHITO (JP)
UENO JUNICHI (JP)
ISHII KAORU (JP)
KISHIDA HIROMI (JP)
NAKANISHI YUYA (JP)
YODA RYOSUKE (JP)
KANAI YOSUKE (JP)
Application Number:
PCT/JP2015/004874
Publication Date:
April 28, 2016
Filing Date:
September 25, 2015
Export Citation:
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Assignee:
SHINETSU HANDOTAI KK (JP)
FUJIKOSHI MACHINERY CORP (JP)
International Classes:
B24B37/00; H01L21/304; B24B37/04; B24B53/02
Foreign References:
JP2013525126A2013-06-20
JP2014039985A2014-03-06
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
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