POLISHING DEVICE - EBARA CORP

Title:

POLISHING DEVICE

Document Type and Number:

WIPO Patent Application WO/1999/051397

Kind Code:

A1

Abstract:

A polishing device for polishing an object to be polished such as a semiconductor wafer to a flat and mirror finish, comprising a turn table on the upper surface of which an abrasive cloth is pasted and a top ring (1), wherein a semiconductor wafer interposed between the turn table and the top ring (1) is pressed with a specified strength and is polished to a flat and mirror finish, the polishing device further comprising a vertically movable pressing ring (3) disposed around the top ring (1) having a recess to receive a semiconductor wafer and a pressing means (22) for pressing the pressing ring (3) to the abrasive cloth with a variable force, the pressing ring (3) being supported on the top ring (1) via a bearing (37).

Inventors:

KIMURA NORIO (JP)
MARUYAMA TORU (JP)
KOJIMA SHUNICHIRO (JP)
KATSUOKA SEIJI (JP)
OHWADA SHIN (JP)

Application Number:

PCT/JP1999/001788

Publication Date:

October 14, 1999

Filing Date:

April 05, 1999

Export Citation:

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Assignee:

EBARA CORP (JP)
KIMURA NORIO (JP)
MARUYAMA TORU (JP)
KOJIMA SHUNICHIRO (JP)
KATSUOKA SEIJI (JP)
OHWADA SHIN (JP)

International Classes:

B24B37/005; B24B37/32; B24B37/00; B24B49/16; B24B55/02; H01L21/304; (IPC1-7): B24B37/00; H01L21/304

Foreign References:

JPH09168964A	1997-06-30
JPH09225821A	1997-09-02
JPH0919863A	1997-01-21
JPH0957612A	1997-03-04
JPH10286769A	1998-10-27

Other References: