POLISHING DEVICE

WIPO Patent Application WO/2003/022522

A1

A polishing device for polishing the flat surface part of a polished material (W) by a polishing tape (T), comprising a polishing device body having a tubular rotary drum (3) having a precisely finished outer peripheral surface, a tape reel (41), a wind−up reel (42) for winding up the polishing tape (T), and the polishing tape (T), the rotary drum (3) further comprising an outer peripheral surface having an axial length longer than that of the polished material (W) crossing the surface thereof, wherein a slit (32) allowing the polishing tape (T) to be inserted after the polishing tape (T) on the tape reel (41) located in the rotary drum (3) is pulled out onto the outer peripheral surface of the rotary drum (3) and wound by one turn on the outer peripheral surface of the rotary drum (3) is provided in the rotary drum (3) in the axial direction, and a polishing stand (6) comprising a slide mechanism (7) for sliding the polishing stand (6) relative to the rotary drum (3) in the direction orthogonal to the axial direction of the rotary drum (3) to bring the flat surface part of the polished material (W) on the polishing stand (6) into contact with the polishing tape (T) wound on the rotary drum (3) when the polishing stand is slid.

MORIKAWA KANAME (JP)
NAKATA HIROMU (JP)

PCT/JP2002/008387

March 20, 2003

August 20, 2002

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NIPPON MICRO COATING KK (JP)
IMT CO LTD (JP)
MORIKAWA KANAME (JP)
NAKATA HIROMU (JP)

B24B21/00; B24B7/22; H01L21/304; (IPC1-7): B24B21/00

JPH09248752A	1997-09-22
JPH07246556A	1995-09-26
JPH07171749A	1995-07-11

Takeuchi, Sumio (6-21 Nishi-shimbashi 1-chome Minato-ku, Tokyo, JP)

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