Title:
POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/067518
Kind Code:
A1
Abstract:
The present invention is a polishing device equipped with multiple polishing heads for holding wafers, a rotatable surface plate on which a polishing cloth for polishing the wafers is affixed, a surface plate-driving mechanism for rotating the surface plate, and multiple wafer-detecting sensors for detecting the expulsion of the wafers from said polishing heads during polishing. The polishing device is characterized in that the wafer-detecting sensors are provided on the downstream side of the respective polishing heads in the surface plate rotation direction and above the area surrounding the circumferences of the polishing heads. Provided thereby is a polishing device capable of preventing wafer damage by earlier detection of the expulsion of wafers from polishing heads during polishing.
Inventors:
UENO JUNICHI (JP)
SATO MICHITO (JP)
ISHII KAORU (JP)
KISHIDA HIROMI (JP)
KANAI YOSUKE (JP)
NAKANISHI YUYA (JP)
SATO MICHITO (JP)
ISHII KAORU (JP)
KISHIDA HIROMI (JP)
KANAI YOSUKE (JP)
NAKANISHI YUYA (JP)
Application Number:
PCT/JP2015/004842
Publication Date:
May 06, 2016
Filing Date:
September 24, 2015
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
FUJIKOSHI MACHINERY CORP (JP)
FUJIKOSHI MACHINERY CORP (JP)
International Classes:
B24B37/34; B24B49/12; H01L21/304
Foreign References:
| JP2003059876A | 2003-02-28 | |||
| JPH07130687A | 1995-05-19 | |||
| JP2006011434A | 2006-01-12 | |||
| JP2001133217A | 2001-05-18 | |||
| JPH08247721A | 1996-09-27 | |||
| JP2000127033A | 2000-05-09 |
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
Good Miya Mikio (JP)
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