Title:
POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/121428
Kind Code:
A1
Abstract:
A polishing device, comprising a base (101), the base (101) being provided with polishing head seats (104); the polishing head seats (104) are provided with two polishing heads (200) for fixing wafers and a linear driving mechanism which is located between the two polishing heads (200) and which is used for driving the two polishing heads (200) to move. During a polishing process, the base (101) is located above a polishing platform (201), the polishing heads (200) drive wafers to rotate, and the polished wafers are taken away along a curved slide rail (102).
Inventors:
YANG YUANSI (CN)
XU XIAOYU (CN)
ZHOU ZHIPENG (CN)
XU XIAOYU (CN)
ZHOU ZHIPENG (CN)
Application Number:
PCT/CN2021/118652
Publication Date:
June 16, 2022
Filing Date:
October 20, 2021
Export Citation:
Assignee:
HANGZHOU SIZONE ELECTRONIC TECH INC (CN)
International Classes:
B24B37/07; B24B37/34; H01L21/00
Foreign References:
| CN112405330A | 2021-02-26 | |||
| JP2002064074A | 2002-02-28 | |||
| CN101990702A | 2011-03-23 | |||
| US20140020830A1 | 2014-01-23 | |||
| CN211465883U | 2020-09-11 | |||
| CN109500712A | 2019-03-22 |
Attorney, Agent or Firm:
HANGZHOU KAIZHI PATENT AGENCY (GENERAL PARTNERSHIP) (CN)
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