POLISHING DEVICE

WIPO Patent Application WO/2022/259833

A1

The present invention improves uniformity of a supply range of a polishing liquid when supplying the polishing liquid while moving, over a polishing pad, a polishing liquid supply head having a plurality of polishing liquid supply ports.　A polishing device 1 includes: a polishing table for supporting a polishing pad 100; a polishing head 30 for holding an object; and a polishing liquid supply device 40 for supplying a polishing liquid between the polishing pad 100 and the object. The polishing liquid supply device 40 includes: a polishing liquid supply head 41 having a plurality of polishing liquid supply ports 414; a link mechanism 60 configured to move the polishing liquid supply head 41 along a polishing surface of the polishing pad 100; and a drive mechanism 90 configured to drive the link mechanism 60. The drive mechanism 90 is configured to drive the link mechanism 60 so that the plurality of polishing liquid supply ports 414 are aligned along the radial direction of the polishing pad 100 in a first state 450 in which the polishing liquid supply head 41 is disposed close to the center of the polishing pad 100, and that the plurality of polishing liquid supply ports 414 are aligned along the radial direction of the polishing pad 100 in a second state 460 in which the polishing liquid supply head 41 is disposed closer to the outer edge of the polishing pad 100 than in the first state 450.

TERADA TETSUYA (JP)
SOTOZAKI HIROSHI (JP)
MORIURA TAKUYA (JP)

PCT/JP2022/020822

December 15, 2022

May 19, 2022

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EBARA CORP (JP)

B24B37/00; B24B55/06; B24B57/00; B24B57/04; H01L21/304

JP2018001374A	2018-01-11
JP2003133269A	2003-05-09
JP2011530422A	2011-12-22

MIYAMAE, Toru et al. (JP)

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