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Patent Searching and Data


Title:
POLISHING FLUID AND CHEMICAL MECHANICAL POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/255581
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a polishing fluid which, when applied to chemical mechanical polishing (CMP) of a work having a cobalt-containing film, is less apt to make the polished surface of said work have erosion or scratches therein. The present invention also addresses the problem of providing a method of CMP with the polishing fluid. This polishing fluid is for use in CMP of a work having a cobalt-containing film, and comprises colloidal silica, an organic acid, a specific nitrogenous aromatic heterocyclic compound, and hydrogen peroxide and has a pH of 8.5-12.

Inventors:
KAMIMURA TETSUYA (JP)
Application Number:
JP2020/018765
Publication Date:
December 24, 2020
Filing Date:
May 11, 2020
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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