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Patent Searching and Data


Title:
POLISHING FLUID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/220919
Kind Code:
A1
Abstract:
Provided is a polishing fluid composition for magnetic disc substrates, that ensures polishing speed and is capable of reducing: surface defects on the substrate surface after polishing; and short-wavelength undulations during continuous use of a polishing pad. This polishing liquid composition for magnetic disc substrates includes a polishing material (component A), a water-soluble polymer (component B), acid (component C), an oxidant (component D), and water. Component B is either: a water-soluble polymer B1 including a constituent unit indicated by formula (I); or a water-soluble polymer B2 having at least some of all R1 and all R2, in a water-soluble polymer that includes a constituent unit indicated by formula (II), being replaced by at least one type selected from a hydrogen atom, an alkali metal, and an organic amine. In formula (I), M1 and M2 each independently indicate a hydrogen atom, an alkali metal, or an organic amine. In formula (II), R1 and R2 each independently indicate an aliphatic hydrocarbon group or an aromatic hydrocarbon group.

Inventors:
YAMAGUCHI NORIHITO
SUGAHARA MASATO
Application Number:
PCT/JP2019/017686
Publication Date:
November 21, 2019
Filing Date:
April 25, 2019
Export Citation:
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Assignee:
KAO CORP (JP)
International Classes:
G11B5/84; B24B37/00; C09K3/14
Foreign References:
JP2015127988A2015-07-09
JP2010170649A2010-08-05
JP2016122487A2016-07-07
JP2011131346A2011-07-07
JP2015507356A2015-03-05
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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