Title:
POLISHING HEAD, POLISHING DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2022/264687
Kind Code:
A1
Abstract:
Provided is a polishing head that has: a first annular member; a blocking member that blocks an upper surface-side opening of an opening in the first annular member; a membrane that blocks a lower surface-side opening of the opening in the first annular member; and a second annular member that has an opening that is positioned below the membrane and holds a workpiece to be polished. A space formed by the opening of the first annular member being blocked by the blocking member and the membrane is partitioned into an inside space and an outside space, where the direction toward the center of the opening in the first annular member is defined as the inside and the opposite direction is defined as the outside, said spaces being partitioned by an annular partitioning wall having an upper annular connection section joined to the blocking member and a lower annular connection section joined to the membrane. The inner diameter of the lower annular connection section of the annular partitioning wall is greater than the inner diameter of the second annular member, and an outer circumferential area for the installation position of the workpiece to be polished is positioned vertically below the upper annular connection section of the annular partitioning wall.
Inventors:
TERAKAWA RYOYA (JP)
OTA HIROKI (JP)
OTA HIROKI (JP)
Application Number:
PCT/JP2022/018384
Publication Date:
December 22, 2022
Filing Date:
April 21, 2022
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B24B37/12; B24B37/30; B24B37/32; H01L21/304
Domestic Patent References:
| WO2013001719A1 | 2013-01-03 |
Foreign References:
| JP2012051037A | 2012-03-15 | |||
| JP2003528738A | 2003-09-30 | |||
| JP2019193968A | 2019-11-07 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
Download PDF: