Title:
POLISHING HEAD AND POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/157276
Kind Code:
A1
Abstract:
The present invention pertains to a polishing head for pressing a polishing tool against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate with such a polishing head. A polishing head (10) is provided with: an annular elastic member (40) for pressing a polishing tool (3) against a substrate (W); and a pressing tool body (43) having a pressing surface (44) for pressing the polishing tool (3) against the substrate (W) via the elastic member (40). The pressing surface (44) has a first fitting groove (45) into which a first site (41) of the elastic member (40) fits. The first site (41) protrudes out from the pressing surface (44). The elastic member (40) is caught onto the pressing tool body (43) in an elastically deformed state. The polishing head (10) is configured so that the polishing tool (3) is pressed against the substrate (W) by the first site (41).
Inventors:
KASHIWAGI MAKOTO (JP)
Application Number:
PCT/JP2021/000326
Publication Date:
August 12, 2021
Filing Date:
January 07, 2021
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B21/00; B24B21/08; B24B21/16; B24B41/047; H01L21/304
Foreign References:
| JP2019107752A | 2019-07-04 | |||
| JP2019077003A | 2019-05-23 | |||
| JP2011161625A | 2011-08-25 | |||
| JPS63300855A | 1988-12-08 | |||
| JP2003071690A | 2003-03-12 | |||
| JP2011161625A | 2011-08-25 | |||
| JP2019107752A | 2019-07-04 |
Other References:
See also references of EP 4101588A4
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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