Title:
POLISHING HEAD AND POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/153243
Kind Code:
A1
Abstract:
The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. The polishing head (10) comprises: a pressing mechanism (12) which presses a polishing tape (2) against a substrate W; and a tape hook (40) which restricts the movement of an edge of the polishing tape (2) in a direction toward the substrate (W). The tape hook (40) has a tape-positioning surface (47) that faces the polishing surface of the edge of the polishing tape (2).
Inventors:
KASHIWAGI MAKOTO (JP)
FUJISAWA MAO (JP)
FUJISAWA MAO (JP)
Application Number:
PCT/JP2023/002698
Publication Date:
August 17, 2023
Filing Date:
January 27, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B21/00; B24B21/06
Foreign References:
| JP2017189868A | 2017-10-19 | |||
| JP2021122895A | 2021-08-30 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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