Title:
POLISHING HEAD AND POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/167001
Kind Code:
A1
Abstract:
The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. The polishing head (10) for polishing the substrate (W) comprises: a pressing member (12) for pressing the polishing tape (2) against the substrate (W); a pressing member holder (30) for holding the pressing member (12); and an actuator (15) connected to the pressing member holder (30) and imparting a pressing force to the pressing member (12). The pressing member (12) is formed in a rod-shape having both ends (12a), and the pressing member (12) is fitted to a groove (50) formed in a pressing surface (30a) of the pressing member holder (30).
Inventors:
KASHIWAGI MAKOTO (JP)
FUJISAWA MAO (JP)
FUJISAWA MAO (JP)
Application Number:
PCT/JP2023/005452
Publication Date:
September 07, 2023
Filing Date:
February 16, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B21/08; B24B21/00; H01L21/304
Foreign References:
| JP2018195853A | 2018-12-06 | |||
| JPS5021197U | 1975-03-10 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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